CommAgility, Mercury Computer Systems, Texas Instruments, Tundra Semiconductor, and Xilinx to present practical implementation details on May 14th
AUSTIN, TEXAS – April 7, 2009 – The RapidIO® Trade Association, dedicated to driving the development and adoption of the RapidIO interconnect standard, will sponsor a half-day RapidIO Technology Tutorial on May 14, 2009, from 8:30 a.m. to noon, during the MicroTCA Summit in Washington D.C.
The half-day event will include presentations from leading members of the RapidIO eco-system that are implementing designs with RapidIO technology. Presentations include:
– Benefits of Data Streaming Protocol
Chunhua Hu, a senior application engineer at Texas Instruments.
– Building High Performance DSP Platform
Harpinder Singh Matharu is Senior Product Marketing Manager in Communications division at Xilinx.
– Critical Embedded Systems with RapidIO Switching
Devashish Paul is Tundra’s Product Marketing Manager for Serial RapidIO switching products.
– Wireless Baseband in microTCA: Antenna Interfaces, RapidIO and Processing
Edward Young is Managing Director and co-founder of CommAgility.
– High performance low power modular MicroTCA Solution
Greg Tiedemann, Director of business development and systems engineering for Mercury Computer Systems’ Communications Computing Segment
In addition, the RapidIO Trade Association will be exhibiting in Booth 104. The MicroTCA Summit brings together vendors and end-users to discuss the latest practical information and trends regarding MicroTCA. Attendees will gain important information on the MicroTCA spec that can handle the latest processors, the newest interfaces, the most demanding high-availability applications, and the latest next-generation wireless networks. For information, visit www.microtcasummit.com/.
About the RapidIO Standard
The RapidIO standard is the embedded interconnect developed by the embedded market specifically for embedded applications. This ISO-certified, open-standard enables best-in-class quality of service and performance in multi-host embedded processor applications – from components to systems – that require reliable, high speed, cost-effective embedded connectivity. The RapidIO interconnect standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems.
The RapidIO Trade Association enables supports and drives the development of the RapidIO ecosystem, and provides the information and resources OEMs need to deliver better solutions, faster. Membership in the RapidIO Trade Association provides the inside track on information, the opportunity to shape specifications, access to pooled resources, and superior overall market awareness. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.