RapidIO TechnologyTechnical White PaperRapidIO Interconnect Technical Fact Sheet The RapidIO™ architecture is an electronic data communications standard for interconnecting chips on a circuit board and circuit boards using a backplane. This new high-performance, packet-switched interconnect technology was designed for embedded systems, primarily for the networking and communications markets. Industry leaders in networking, communications, semiconductors, and embedded systems have founded the RapidIO Trade Association to develop and support this new open standard. An important bottleneck in networking and communications equipment is the speed at which the various components "inside the box" communicate with each other. The RapidIO architecture eliminates this bottleneck. Current equipment is limited to hundreds of Mbits per second transfer rates using legacy bus technologies such as PCI. The new RapidIO interconnect increases this bandwidth significantly. Many believe that increases in bandwidth have already replaced increases in microprocessor performance as the key requirement for higher-performance Internet technology. Designed for Networking and Communications EquipmentDesigned for networking and communications equipment, enterprise storage, and other high-performance embedded markets, the RapidIO architecture addresses the demand for higher performance networking equipment for use in the Internet infrastructure. RapidIO architecture offers the bandwidth, software independence, fault tolerance, and low latency required in the networking market. The RapidIO specification defines a high-performance interconnect architecture designed for passing data and control information between microprocessors, DSPs, communications and network processors, system memory, and peripheral devices within a system. It was designed to replace current processor and peripheral bus technologies such as PCI and proprietary processor buses. The initial RapidIO specification defines physical layer technology suitable for chip-to-chip and board-to-board communications across standard printed circuit board technology at throughputs exceeding 10 Gbits per second utilizing low voltage differential signaling, (LVDS) technology. Unlike other next-generation I/O technologies, RapidIO technology is transparent to application software, and does not require special device drivers. Additionally, it has no impact on operating system software. The RapidIO Interconnect can also be a bridge to other bus technologies such as PCI, PCI-X, and system area networks like InfiniBand. A rich variety of features are provided in the RapidIO interconnect including high data bandwidth capability and support for high-performance I/O devices, as well as globally shared memory, message passing, and software managed programming models. A Partitioned ArchitectureThe RapidIO standard is a packet-switched interconnect architecture conceptually similar to internet protocol (IP). However, the RapidIO architecture is designed to be used for the processor and peripheral interface where high bandwidth and low latency are crucial. The RapidIO architecture is partitioned into a three-layer hierarchy of logical, transport, and physical specifications, which allows scalability and future enhancements while maintaining compatibility. RapidIO Features
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