RapidIO technology has been compared to a wide range of interconnect technologies, primarily because it has the broadest range of scalability for system design - from parallel local bus to traffic managed fabric. While some interconnects will indeed go head-to-head with RapidIO, the more pressing concern is how interconnects can co-exist in a system.
As application needs change in bandwidth and functions, there must be compatibility among interconnects to enable easier evolution of designs. That's why RapidIO technology was designed to interwork with other interconnects through Type 9 encapsulation. For example, many systems today leverage PCI Express for a chip-to-chip interconnect; however, PCI Express cannot scale to be a system fabric. RapidIO technology can seamlessly pass PCI Express packets through its high-bandwidth pipe, thus enabling designers to leverage the benefits of RapidIO while sustaining legacy technologies.
Resources on this page offer more detailed information regarding comparisons, contrasts, and compatibilities of RapidIO technology with various interconnects.
Comparative White Papers
PCI Express White Paper (2004)
RapidIO Technical Notes