The TWG proactively addresses the interconnect needs of the embedded systems and distributed processing applications space. The key is to identify and improve on weaknesses of past interconnects, while looking ahead to the complex needs of data and control plane applications. The TWG drives the RapidIO specifications and is represented by the leading telecom OEMs, silicon vendors, system integrators, and software companies in this space.

"I'm looking forward to my new role within the TWG as we continue to expand the capabilities and target application space of RapidIO technology. I truly believe that the companies and individuals that form the TWG are second to none and will continue to provide the insight needed to address the evolving market," said Scheckel. "As more and more RapidIO devices are released, there will be a strong desire to show interoperability among vendors. This will be a key area addressed b the TWG moving forward. Additionally, during the early stage of RapidIO adoption, it will be important to demonstrate an interworking relationship with existing and entrenched interconnect standards, such as Ethernet. The TWG will continue to work towards these goals while increasing the rich feature set of the RapidIO interconnect and widening the gap between competing offerings."

The primary focus of the TWG over the next six months to a year is:

1. Introduce the next generation serial PHY that will include both higher data rates and wider lane widths.
2. Release the second phase of the Data Streaming Logical Layer Specification which includes support for virtual channels and higher level end-to-end flow control capabilities.